IC chip (
Is will be a lot of microelectronic components (
The transistor, resistor, capacitor, etc. )
The formation of integrated circuit on a piece of plastic base, make a chip.
IC chips contain wafer and packaging chip, the corresponding IC chip production line consists of two parts, wafer production line and packaging production line.
Chip is a carrier of integrated circuit, composed of multiple wafer segmentation, for semiconductor components of a general designation.
Chip is characterized by small volume, high integration density, on the chip surface machining marking the accuracy requirement is very high, in the process of requirements on the premise of not damage components, mark clear text, type, vendor information, etc.
For technology standard, which requires more precision laser marking machine, it puts forward more requirements on laser marking.
Combined with the chip marking requirements, refer to the laser marking process, only is the most ideal choice for IC chip solutions: (laser automatic marking system
Confirm the selection of laser to meet the requirements of the workpiece quality and appearance.
Filtered as a result, the existing laser type, confirm the right class of laser and power.
To complete the automatic laser marking system of IC chip joint debugging and commissioning, according to different IC chip products, optimize the control parameters, satisfying the requirements of equipment design and IC chip precision of laser marking requirements.
Realize the laser automatic marking precision guarantee of IC chips, on the basis of mechanical positioning, combined with digital image processing system, image processing card as the core of multi-axis motion control card to control motor system with DSP card control of excitation light galvanometer scanning marking technology, realize high precision IC chip, a laser target, high speed requirements.
Development, laser automatic marking control software using object oriented programming method based on visual man-machine interface, integration with laser, image processing system and motion control system operation.
IC design overall mechanical structure, automatic laser marking system adopts modular structure design, reconfigurable design, on the one hand, upgrading to reduce costs, improve efficiency.
Fixture can be replaced rapidly at the same time, many varieties, small batch of flexible production of IC chips.
In 5 points, requires in the IC chip encapsulation adhesive surface marker permanent 0.
About 5 mm size of characters and corporate Logo design, to identify the product in order to track and enterprise publicity.
Due to the IC area is small, marking location accuracy requirement high -
Less than zero.
, which is suitable for using laser marking.
At the same time combined with the mechanical and electrical system design can realize many varieties, small batch of IC marking flexible production.
Laser marking equipment recommended: preferential deals offer 4007001618 【
Optical fiber laser marking equipment 】
Mainly used for metal and non-metallic laser marking part USES, tags and beautiful, fast, no material;
CO2 laser marking equipment 】
Non-metallic products used for the laser marking purposes;
Uv laser marking equipment 】
Adopt import uv laser, it is mainly used for metal and non-metallic products fine marking purposes;
Metal laser marking equipment 】
Based on customer specific products, production line, the demand for design and production and customer demand, customized models.
Semiconductor laser marking machine 】
Stable performance, price moderate 【
Green laser marking machine 】
High prices, product customization is given priority to
YAG laser marking machine 】
Metal, plastic and other products used for moderate price more metal laser marking equipment laser marking machine, laser marking precision laser marking